Microelectronics has been a hot topic in technology circles in recent years. Although the CHIPS and Science Act is a main driver of the latest resurgence, the defense industrial base’s reliance on ...

Lux Semiconductors' System-on-Foil technology is designed to reduce the size and improve the performance of microelectronics for spacecraft, aircraft and other applications. Credit: Lux Semiconductors ...

WEST LAFAYETTE, Ind. – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to ...

WEST LAFAYETTE, Ind. — Purdue University, a national leader in microelectronics research and workforce development, will host a workshop to discuss challenges and opportunities related to the future ...

SCHOTT’s new hermetic packages weigh up to two-thirds less than conventional microelectronic packages made of kovar. Made of aluminum, the new packaging is designed to protect against the harsh ...

This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. “With the continuous miniaturization of ...

ANDOVER, Mass., April 21, 2022 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, hosted a ...

Non-destructive inspection techniques play a pivotal role in assuring the integrity and performance of microelectronic packages as device architectures become ever more compact and heterogeneous.

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today that the International ...

ASX is posting record ATM revenue and raising its LEAP outlook above $3.5B, as advanced packaging demand climbs with AI infrastructure.