Chinese semiconductor packaging giant Jiangsu Changjiang Electronics Technology (JCET) plans to invest $1.15 billion in a new ...
AMPERA is launching gas-powered, high-efficiency energy systems that share a design core with its upcoming nuclear reactors.
Advanced energy technology group AMPERA announced the company has completed production of what it called the first full-scale ...
Researchers developed a process to recover silicon and silicon dioxide (SiO₂) from end-of-life crystalline silicon solar ...
IICIE Emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and ...
The global flexible barrier films for electronics market is growing at a robust pace, expected to be valued at around US$ 400.3 million in 2026 and projected to reach US$ 1,104.4 ...
The recently reported cyberattack against Tata Electronics is shaping up to be one of the most consequential attacks exposing ...
Q: Are chiplets simply an evolution of multi-chip modules (MCMs) from the 1990’s? A: In many ways, yes. Early multi-chip ...
UK-based Dynex Semiconductor has announced the development of a new 450A, 650V GaN half-bridge power module, designed to ...
KnowMade has launched two patent monitoring services dedicated to SiC technology: the SiC Substrates & Epitaxial Wafers ...
Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...
GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) ...
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